Product category: Communications ICs (Wired)
News Release from: Renesas Technology Europe
Edited by the Electronicstalk Editorial Team on 13 July 2004
LSI to aid freedom
of mobile multimedia access
Renesas and NTT DoCoMo are to jointly develop a single-chip LSI for dual-mode handsets for third-generation W-CDMA and second-generation GSM/GPRS
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Renesas Technology Corp has signed an agreement with NTT DoCoMo to jointly develop a single-chip LSI for dual-mode handsets for third-generation W-CDMA and second-generation GSM/GPRS, with the aim of promoting the global use of FOMA services. The two companies will combine W-CDMA technology developed by NTT DoCoMo with Renesas Technology's LSI fabrication, multimedia application processor, and GSM/GPRS technologies, to achieve single-chip implementation of a baseband LSI and SH-Mobile application processor for dual-mode handsets.
Major features of the new LSI include: support for W-CDMA+GSM/GPRS dual-mode handsets; the combination of the baseband LSI and SH-Mobile application processor on a single chip; and the use of the SH-Mobile third-generation CPU core offering powerful multimedia application processing, including image, audio and Java capabilities, together with low power consumption.
The two companies plan to have a product ready in the first half of fiscal 2006.
Renesas Technology will collaborate with NTT DoCoMo to offer handset manufacturers a platform based on the new LSI and promote worldwide use of FOMA services and reduce costs.
Renesas Technology also plans to provide this single-chip LSI for the UMTS market.
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