Extensive product announcements for RapidIO

2006 has been a significant year for designers integrating RapidIO technology into their high performance solutions for storage, wireless communications, triple play and other embedded markets

2006 has been a significant year for designers integrating RapidIO technology into their high performance solutions for storage, wireless communications, military, industrial, triple play and other embedded markets, as products proliferate, the first RapidIO test facility is operational, and Global Design Summits aid in product development.

"2006 has truly been the year of RapidIO deployment from OEM design activity and product deployment, to interoperability and interworking, and, of course, market share growth," said Tom Cox, executive director for the RapidIO Trade Association.

"As we near 2007, it is clear that the powerful RapidIO ecosystem will continue to execute on its technology roadmap and drive applications in new and emerging embedded markets across the globe".

These milestones, combined with a re-affirmation of leading OEMs to the RapidIO standard along with a growing ecosystem, accentuated the continued market momentum for this established interconnect standard.

The year's highlights included: Lockheed Martin confirms use of Mercury Computer Systems' PowerStream 7000 FCN for use with the Aegis Weapon System for the U.S.

Navy; OEM Emerson Network Power implemented Tundra's Tsi568A Serial RapidIO Switch into the Fat Pipe switch module in its 12-slot MicroTCA development system; More than 20 new products encompassing development platforms, switches, processors, DSPs, protocol analysers and FPGAs made their debut in 2006, rounding out the breadth and depth of RapidIO-based solutions needed to implement high-performance, cost-effective designs in embedded applications; 16 RapidIO ecosystem members including Agilent, Altera, CS Electronics, Embedded Planet, Fabric Embedded Tools, Freescale Semiconductor, FuturePlus Systems, IDT, Jennic, Mercury Computer Systems, PMC-Sierra, and Silicon Turnkey participate in live demonstration of high performance, commercially available RapidIO evaluation boards, software, and test tools; RIOLAB, the world's first RapidIO interoperability lab commences interoperability testing for vendors and OEMs designing with RapidIO technology; offers DIL-3 testing; Market leaders AMCC, EMC, Ericsson, Freescale Semiconductor, Lucent Technologies, Mercury Computer Systems, PMC-Sierra, Texas Instruments, Tundra Semiconductor, and Wind River endorse the RapidIO standard; RapidIO Radio debuts offering in-depth technical insight on a range of topics to embedded design community via podcasts; RapidIO Trade Association offers a wide range of design support as global demand grows; Global Design Summits, webinars, and podcasts attract record attendance; New members DFT Microsystems, Continuous Computing, ELVEES, RIOLAB, and Zarlink expand the breadth of eco-system; The RapidIO Technical Working Group defines the next generation physical layer spec and sends it to ballot; backward and forward compatibility ensured.

In 2007, the RapidIO Trade Association and its member companies will increase efforts to broaden the RapidIO technology knowledge base with Global Design Summits in North America, Asia, and Europe.

In addition, an expanded schedule of webinars, RapidIO Radio podcasts, demonstrations, and article series will be offered to the global embedded market throughout the year.

RapidIO technology is an established, scalable, packet-switched, high-performance fabric specifically developed to address the needs of equipment designers in the wireless infrastructure, edge networking, storage, scientific, military and industrial markets.

Under active development since June 1997, the RapidIO standard represents continued commitment of the RapidIO Trade Association to addressing the needs of the ever-changing networking and communications marketplace.

The RapidIO Trade Association and its global members drive the RapidIO interconnect architecture.

This ISO-certified, open-standard seamlessly enables the chip-to-chip, board-to-board, control, backplane and data plane interconnections needed in high-performance networking, communications and embedded systems.

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