Product category: Programmable Logic Devices
News Release from: QuickLogic | Subject: ArcticLink
Edited by the Electronicstalk Editorial Team on 29 May 2008
Programmable platform shrinks to chip
scale
ArcticLink reduces design time and risk for mobile product developers by embedding hard-wired host controllers with a programmable fabric - all in a single low-power device.
QuickLogic's innovative connectivity platform targeting the handheld electronics product market, ArcticLink, is now available in compact wafer level chip scale packaging (WLCSP) ArcticLink reduces design time and risk for mobile product developers by embedding hard-wired host controllers with a programmable fabric - all in a single, low power device
This article was originally published on Electronicstalk on 21 Mar 2007 at 8.00am (UK)
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Programmable connectivity for embedded processors
ArcticLink embeds high-performance controllers, a programmable fabric for implementing additional controllers and peripheral connectivity, and a selectable processor interface all in a single chip.
Programmable platform connects in the hand
The ArcticLink programmable connectivity platform for embedded systems processors targets the handheld electronics product market.
The new 4.42 x 5.74mm WLCSP version of this device saves considerable PCB space compared with conventional BGA packaging, helping developers to pack more features into smaller form factors.
"As mobile devices grow in complexity, designers are hard pressed to pack additional functionality and intelligence into smaller footprints", said QuickLogic's Senior Solutions Marketing Manager, Howard Li.
"By delivering our ArcticLink CSSP platform in WLCSP form, we allow handset OEMs and ODMs to address all their connectivity needs in the smallest possible area".
ArcticLink is part of QuickLogic's customer specific standard product (CSSP) offering.
It combines hard-wired building blocks such as Hi-Speed USB 2.0 On-The-Go, SD, SDIO, MMC and CE-ATA, with an ultra-low-power programmable fabric for implementing custom functions.
QuickLogic customises the fabric, usually in a matter of days or weeks.
Fabricating the CSSP then requires only electrical programming of a stock wafer.
WLCSP eliminates the area overhead of conventional BGA packaging.
It is achieved with a standard die by fabricating an additional metal redistribution layer to reroute the I/O lines from the perimeter bonding pads to an array.
It then bumps (adds solder balls to) the array, making it ready for customers to use in conventional surface-mount fabrication processes.
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