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Amkor Technology and PMC-Sierra have developed a second generation of flip-chip packaging solutions.
PMC-Sierra worked with Amkor engineers to define the packaging architectures that achieve lower power and smaller die size required for networking equipment.
The new flip-chip packaging solutions are used in PMC-Sierra's 10 gigabit Ethernet Xenon family of devices and PMC-Sierra's OC-48 and OC-192 transport optimised Chess-III chipset.
With its superior signal integrity characteristics, reduced footprint and high current distribution capability, flip-chip packaging is ideally suited for the high speed processing demanded by ultra-high performance networking applications.
The technology supports up to 258 3.125Gbit/s serial links.
"Amkor is working closely with PMC-Sierra to develop flip-chip packaging solutions that support high performance applications, ranging from wireless base station equipment to large-scale networking systems", said Richard Groover, Amkor's vice president for flip chip technology.
"We are also working together on a product roadmap that employs more advanced substrate technologies to further enhance the price/performance of flip-chip solutions".
"PMC-Sierra is also collaborating with Amkor on third generation flip-chip solutions to create higher performance IC architectures", said Greg Aasen, chief operating officer at PMC-Sierra.
"Flip-chip technology offers the industry's highest levels of signal integrity, while simultaneously improving performance efficiencies".
 

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