News Release from: Phasebridge
Edited by the Electronicstalk Editorial Team on 28 February 2005
University link works towards RF opto circuits
Phasebridge is working with University of California, San Diego to develop semiconductor electroabsorption modulator technology for rugged, high-performance microwave links.
Note: Readers of the Editor’s free email newsletter will have read this news when it was announced. . It’s free!
Phasebridge, a specialist in advanced photonic integration technologies, devices, and system solutions announces a joint effort with University of California, San Diego (UCSD) to develop semiconductor electroabsorption modulator (EAM) technology for rugged, high-performance microwave links. The agreement between Phasebridge, UCSD, the Defense Advanced Research Projects Agency (DARPA) and the US Air Force Research Laboratories (AFRL), will enable the development of low cost and compact semiconductor optical modulators for high-performance fibre optic links in harsh environments. Phasebridge designs and manufactures rugged and compact photonic hybrid chip-scale packaging and is a leading developer of optical devices and subsystems for analogue radio frequency (RF) signal processing and fibre transmission.
The UCSD research team, led by electrical engineering Professors Paul Yu and William SC Chang at the Jacobs School of Engineering, has pioneered novel EAM structures known as intra-step quantum wells (IQWs) and peripheral-coupled waveguides (PCWs) which dramatically increase optical power handling capability - a critical factor for high-linearity analogue RF optical systems.
The combined research effort will advance the development of these EAMs for high performance microwave applications in extreme environments and will feature unprecedented linearity over very broad bandwidths.
These modulators have applications in analogue microwave fibre optic links for expanding markets in aerospace and defense, satellite earth stations, wireless antenna fibre optic remoting, and cable television transmission.
Phasebridge Chief Technology Officer Ron Logan notes: 'We are very excited by the collaboration between our company and UCSD because it combines our practical optical packaging experience and capabilities with the latest advances in semiconductor structure technology'.
'The development and demonstration of these packaged EAM devices will enable high-linearity microwave fibre optic links that will greatly expand the capabilities of today's RF communications technology in both military and commercial applications'.
• Phasebridge: contact details and other news
• Other news in Optoelectronics
• Email this news to a colleague
•
• RSS news feed for Phasebridge
• RSS news feed for Optoelectronics
• Electronicstalk Home Page
Copyright © 2000-2006 Pro-Talk Ltd, UK. Based on news supplied by Phasebridge