Complete Bluetooth system shrinks to one package
A NXP Semiconductors product story
Edited by the Electronicstalk editorial team Nov 13, 2003
The BGB202 SiP is billed as the industry's first complete plug-and-play Bluetooth solution in a single low-cost chip package for applications such as mobile phones, headsets, car kits and PDAs.
The BGB202 system-in-a-package (SiP) is billed as the industry's first complete plug-and-play Bluetooth solution in a single, low-cost chip package for applications such as mobile phones, headsets, car kits and PDAs.