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Product category: Power Supply ICs and Controllers
News Release from: NXP (formerly Philips Semiconductors) | Subject: PIP250M
Edited by the Electronicstalk Editorial Team on 29 October 2002

Integrated convertor boosts
onboard power density

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A new device from Philips integrates five component functionalities required for a single-phase DC/DC synchronous buck convertor in a single package

The PIP250M chip provides a board space savings of 20 to 30% and has the ability to convert 5V down to between 1 and 3.3V, offering best-in-class power density for 7-15A applications such as telecommunications, datacommunications and enterprise computing. Based on Philips' leading TrenchMOS semiconductor technology, the PIP250M chip is an expansion of Philips' powertrain portfolio.

The device incorporates pulsewidth modulation (PWM) control, drivers, control FET, sync FET and a parallel Schottky diode in a single ready-made device.

Typically, designers of telecommunications, datacommunications and enterprise computing devices have to contend with the problem of multiple ICs with varying voltage needs in one design.

The PIP250M provides the solution design engineers need to deal with complex power management systems.

This device is ideal for integration into new systems as it provides ease-of-use and design simplification, resulting in a quicker time to market.

"Philips' PIP250M chip is designed for customers who want relief from the hassle of designing, selecting and procuring a host of separate devices for what is essentially for them, a secondary activity", said David Sharples, Power Product Marketing Manager, Philips Semiconductors.

"Having identified a demand in the market for a convertor in the 7-15A range, our team developed this innovative solution that meets designers' needs and provides them with a simple solution when dealing with complex power management systems".

The PIP250M is currently in volume production.

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