Product category: Communications ICs (Wired)
News Release from: NXP Semiconductors
Edited by the Electronicstalk Editorial Team on 21 February 2002
TriQuint agreement keeps Philips up with
III-V
Philips Semiconductors and TriQuint Semiconductor have signed an agreement that guarantees Philips Semiconductors controlled access to TriQuint's InGaP HBT 150mm wafer processing facilities.
Philips Semiconductors and TriQuint Semiconductor have signed an agreement that guarantees Philips Semiconductors controlled access to TriQuint's InGaP (indium-gallium-phosphide) HBT (heterojunction bipolar transistor) 150mm wafer processing facilities, and provides for joint development of future advanced high-performance process technologies This agreement provides Philips Semiconductors important access to the technology-of-choice for critical components in the PA (power amplifier) and FE (front-end) modules that it designs and manufactures for the mobile phone industry, while ensuring that TriQuint will enhance its position as a leading supplier for GaAs devices
This article was originally published on Electronicstalk on 23 Oct 2001 at 8.00am (UK)
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