News Release from: Praesagus
Edited by the Electronicstalk Editorial Team on 1 June 2004

IMEC to help with modelling extension

IMEC and Praesagus have signed a technology development agreement to extend Praesagus' physics-based modelling approach for pattern-based interconnect manufacturing variation.

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IMEC and Praesagus have signed a technology development agreement to extend Praesagus' physics-based modelling approach for pattern-based interconnect manufacturing variation. The partnership will build on Praesagus' physics-based interconnect thickness variation modelling technology and expand the scope to include copper/low-k and three-dimensional modelling. The partnership will leverage IMEC's copper damascene, ultra low-k dielectric and 65nm expertise and experience.

Developing next-generation processes for electrochemical deposition (ECD) and chemical mechanical polishing (CMP) will require a much more detailed understanding of the causes of interconnect variation and solutions to mitigate those causes.

"IMEC has initiated this program with Praesagus to help our core technology partners address a serious concern as they move to the next process node", said Karen Maex, PhD, IMEC Fellow in the Silicon Process Technology Division.

"The current design for manufacturing (DFM) communication paradigm of CMP design rules and worst-case thickness tech files is running out of steam and the recently proposed alternative of density-based models does not provide enough accuracy", said Hugo De Man, IMEC Senior Research Fellow.

"In our System-Level Integration Programme, IMEC is researching the impact of process variability in deep submicron technologies on circuit and system level".

"Variability in interconnect RC delays is a main concern as we are scaling down technology beyond the 90nm node".

"Praesagus' expertise in physics based modelling of interconnect technology offers a promising alternative to accurately predict the interconnect performance, serving as a critical input to system designers".

"IMEC has been a pioneer in addressing leading edge issues in semiconductor manufacturing by partnering with industry leaders", said Taber Smith, Praesagus President.

"We are pleased to collaborate with Europe's leading applied research organisation and leverage both their processing expertise and also their design expertise".

The term of the agreement is two years.

IMEC Industrial Affiliation Partners will have early access to the technology and Praesagus expects to incorporate the results into its commercial products.

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