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Product category: Electronics Manufacturing Quality Assurance
News Release from: Practical Components | Subject: K and S PB series
Edited by the Electronicstalk Editorial Team on 15 August 2002

Test die checks out bump or assembly
methods

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The PB (perimeter bump or bond) series from K and S Flipchip Division is now available from Practical Components for simulating the I/O of CMOS-like devices of various pad pitches.

The PB (perimeter bump or bond) series fr