Product category: Test Accessories
News Release from: Owens Design | Subject: Wafer Flip Module
Edited by the Electronicstalk Editorial Team on 13 February 2006
Flipper puts wafers in the frame
A new Wafer Flip Module is designed for 300 and 200mm wafers, and is compatible with both edge grip and vacuum paddle end effectors
Owens Design has added a Wafer Flip Module to its family of custom wafer handling solutions. New manufacturing processes and the increasing need for backside contamination inspection require wafers to be loaded to the process or inspection chamber in a 90 or 180 degree 'flipped' orientation.
This article was originally published on Electronicstalk on 13 February 2006 at 8.00am (UK)
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The Wafer Flip Module is designed for 300 and 200mm wafers and is compatible with both edge grip and vacuum paddle end effectors.
It has been selected by a leading supplier of standard EFEMs (equipment front end modules) for incorporation into its product line.
The Wafer Flip Module has two motors, one for flipping and one for the wafer gripper mechanism.
A 180-degree rotation of the wafer can be performed in less than 2s.
The flipper is designed so that no particles (0.10um or greater) are detected in the wafer path during airborne dynamic motion tests.
All motors and motion mechanisms are contained in a purged enclosure to eliminate any particle generation during the wafer flipping process.
The system is designed with all SEMI and CE compliance and mounts to pre-existing M6 holes in standard EFEMs.
Mark Danna, Sr Director of Owens Design stated: 'Our customer challenged us to come up with a cost effective and high reliability design while solving demanding speed and particle generation tests'.
'Our history of solving problems in custom wafer handling allowed us to come up with a very clever solution'.
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