Product category: Power Supply ICs and Controllers
News Release from: ON Semiconductor | Subject: SOD-123FL packaged devices
Edited by the Electronicstalk Editorial Team on 27 June 2003
Novel package increases
power density onboard
ON Semiconductor has added the SOD-123FL package to its comprehensive portfolio of discrete components
50 devices, including transient voltage suppression (TVS) components and Schottky diodes, are now available in the low-profile, flat-lead package. Additional devices will become available in the new packaging later this year. "Because the SOD-123FL maximises power dissipation per unit of board space utilised, the package is the ideal choice for TVS components and Schottky diodes necessary in portable and wireless board designs that must meet strict power management and protection requirements", said Charlotte Diener, ON Semiconductor Vice President and General Manager of Standard Components.
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The SOD-123FL packaged devices are drop-in replacement for the well established SOD-123 (JEDEC DO219) footprint, yet deliver superior power-handling capability.
Comparatively, the watts per square millimetre thermal performance of the SOD-123FL exceeds that of the SOD-123 by 149%; it improves on the performance of the SMA by 90.5% and beats the performance of the PowerMite by 26.5%.
The profile of the SOD123FL (1mm maximum) is more than 25% lower than a standard SOD123 package - making it ideal for board-space-conscious portable applications.
Further reading
Controllers cut notebook power
Power controllers are specifically designed to meet the efficiency requirements of notebook PCs
The SOD-123FL package enables a low forward voltage (VF) because of its unique lead frame and clip design that delivers optimum power efficiency.
The clip-attach internal design provides superior surge-current capability compared to wire bond packages - making it an ideal package choice for transient voltage suppression applications.
ON Semiconductor's low-leakage-current silicon technology has been designed into the new packaging to improve energy savings.
The SOD123FL delivers this enhanced performance in an environmentally friendly, lead-free package platform.
This package has a 100% tin (Sn) finish on all externally plated surfaces.
It is 260C reflow capable to MSL 1 and, it is backward compatible with existing reflow processes.
ON Semiconductor has released 50 of its proven standard components in the SOD123FL package.
These include: the SMF 5.0 series of 5 to 170V TVS devices capable of 200W; the MBR120VLSFT1, a 1A, 20V Schottky power rectifier diode with very low forward voltage to help extend battery life for portable applications; the MBR120LSFT1, a 1A, 20V Schottky power rectifier diode with low forward voltage to extend battery life for portable applications; the MBR120ESFT1, a 1A, 20V Schottky power rectifier with low leakage; and the MBR140SFT1, 1A, 40V Schottky power rectifier that is optimised for low forward voltage and low leakage.
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