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Product category: Optoelectronic Sensors, Switches and Receivers
News Release from: OmniVision | Subject: OV3630DZL
Edited by the Electronicstalk Editorial Team on 16 February 2006
Stacked die camera chip upgrades to
3Mpixel
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Launched at the 3GSM World Congress in Barcelona, the OV3630DZL stacked die CameraChip device drops in to upgrade cameraphones to 3Mpixel resolution.
This week at the 3GSM World Congress in Barcelona, OmniVision Technologies introduced the OV3630DZL stacked die CameraChip solution With a module size of 9 x 9 x 7mm, the OV3630DZL allows handset customers to upgrade their camera phones from 2Mpixel (OV2630DZL) to 3Mpixel without mechanical design changes
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