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Product category: Optoelectronic Sensors, Switches and Receivers
News Release from: Oki Electric
Edited by the Electronicstalk Editorial Team on 25 January 2007
Chip-size package to shrink CMOS and CCD
sensors
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The ZyCSP is a chip size package for image sensors with buried interconnect technology developed by ZyCube.
Oki Electric and ZyCube are to co-operate in commercialising an image sensor LSI with buried interconnects (also called TSV - through silicon via) that is equivalent in size to a wafer-level chip size package (CSP) Compared with current CMOS and CCD sensor packages, the ZyCSP achieves thinner, smaller, lighter and highly reliable characteristics
This article was originally published on Electronicstalk on 10 Apr 2002 at 8.00am (UK)
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