Product category: PCB Assembly Equipment and Tools
News Release from: OK International | Subject: APR-5000-XLS
Edited by the Electronicstalk Editorial Team on 19 March 2007
Rework system reflows lead-free BGAs
gently
Optimised heating scheme avoids excessive lid temperatures, melting joints outside the rework area, warping of the PCB or distorting the plastic bodies of connectors.
OK International has developed optimised heating for lead-free BGA rework, allowing users of the APR-5000-XLS array package rework system to reflow lead-free BGAs without incurring excessive lid temperatures, remelting soldered joints outside the rework area, warping of the PCB or distorting the plastic bodies of connectors such as RJ45s "Lead-free BGA rework requires new heating algorithms because peak reflow temperatures are close to the maximum lid temperature of 250-260C recommended by IC vendors and the IPC", said Paul Wood, Market Development Manager for OK International
This article was originally published on Electronicstalk on 10 May 2005 at 8.00am (UK)