Product category: Communications ICs (Wired)
News Release from: Oxford Semiconductor
Edited by the Electronicstalk Editorial Team on 07 October 2005
Acquisition adds USB expertise to
FireWire
Oxford Semiconductor has acquired TransDimension a leading provider of USB connectivity solutions for embedded applications.
Oxford Semiconductor has acquired TransDimension a leading provider of USB connectivity solutions for embedded applications The move strengthens Oxford's connectivity product portfolio and expands its global presence through the creation of a new, US-based parent company
This article was originally published on Electronicstalk on 13 Dec 2001 at 8.00am (UK)
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A market leader in interface bridging ICs and FireWire based external storage solutions, Oxford Semiconductor's acquisition of TransDimension places the company in a position of technology leadership as the preeminent supplier of complete FireWire and USB-based connectivity solutions for the rapidly growing consumer electronics, storage, audio and addon card markets.
The acquisition also enhances the new company's prospects for the successful participation in wireless USB, projected to be widely used in many future consumer, storage and PC peripheral applications.
William MacKenzie, Oxford Semiconductor President and CEO, commented: "TransDimension brings not only the size to enable us to reach a greater critical mass and lower relative cost structure, but also a complete range of USB connectivity solutions including the popular SoftConnex USB embedded software, and complements Oxford's strength in 1394".
"The TransDimension team is pleased to join Oxford Semiconductor in the pursuit of world class connectivity solutions", said Rick Goerner, TransDimension President and CEO.
"The acquisition provides an ideal blend of technologies for our combined, global customer base".
"Both companies possess leadership positions in our respective markets and share a common solutions-oriented corporate model focused on connectivity".
Formerly headquartered in the UK, Oxford Semiconductor has relocated its headquarters to Milpitas, California.
The company will maintain its UK Design Centre as well as its regional offices in North America, Singapore and Taiwan.
TransDimension's Irvine-based facilities will remain in place.
Under the terms of the acquisition, Rick Goerner will become Senior Vice President of Sales and Marketing.
TransDimension's product portfolio will become one of four product lines in the Oxford Semiconductor family of products.
The new company has a strong, global customer base that includes Behringer, Griffin, Hewlett-Packard, Lacie, LG, Maxtor, NCR, Pioneer, Samsung, Siemens, Sony and Thales.
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