News Release from: Octasic
Edited by the Electronicstalk Editorial Team on 17 February 2005
Three-chip solution shrinks voice gateways
TranSwitch and Octasic Semiconductor have developed an integrated solution for voice over packet (VoP) gateway implementations that allows OEMs to increase density and lower costs.
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TranSwitch and Octasic Semiconductor have developed an integrated solution for voice over packet (VoP) gateway implementations that allows OEMs to increase density and lower costs. Through the complementary fit and functionality of the TranSwitch TEPro, Octasic OCT8304 and OCT6100 devices, the two semiconductor vendors are able to implement a gateway's voice plane functionality on a single card, using only three chips, resulting in a faster time to market for OEMs. The companies have also revealed that a leading manufacturer of PON optical line terminals (OLT), used to enable fibre-to-the-premises (FTTP), has completed its design and field trials of a retrofittable DS3-rate high-density VoATM gateway using the TranSwitch/Octasic solution.
'TEPro has proven to be an ideal TDM network interface device for voice gateways', said Brian Stroehlein, Product Marketing Manager for TranSwitch.
'By combining TEPro with Octasic's voice over packet (VoP) and echo cancellation (EC) devices on a common H.110 bus, OEMs can rapidly implement high density VoP gateways'.
The Octasic and TranSwitch devices are interconnected seamlessly with their common H.110 interfaces.
Originally designed for cPCI applications incorporating a TDM backplane, H.110 is also usable as a device-to-device interconnect, enabling the full-duplex transfer of over 2000 voice channels across one bus.
'Octasic's devices combined with TranSwitch's TEPro greatly reduce time to market for equipment manufacturers due to the ease of integration', said Frederic Bourget, Octasic's Director Product Management.
'Together we provide an end-to-end solution from packet interfaces to voice processing to TDM'.
TranSwitch's TEPro, a RISC processor-based device, integrates: a flexible (H.110, MVIPTM, transmission, unframed) terminal interface; M13/G.747 multiplexer; DS3 framer with full Cbit functionality to support clear-channel DS3; 28-channel DS1 framer; 21-channel E1 framer; 28-channel DS1/E1 crossconnect; 672 DS0 x 4096 time slot nonblocking crossconnect for grooming, concentration, switching and multiplexing; message mailbox FIFO; multichannel HDLC for message-based signalling; and a high performance, on-chip RISC processor for flexible, programmable control.
On the line side, users may select one DS3, 28 DS1, or 21 E1 line interfaces.
This density lets OEMs deliver optimal cost/performance with unmatched space and power efficiency - a critical advantage in designing denser, smaller systems.
Octasic's OCT8304 packetisation engine offers complete, standard compliant, AAL2 implementation at an unprecedented 1023 channel capacity, the highest capacity in voice packetisation and aggregation on the market.
The device provides stand-alone high-density G.711 packetisation for VoIP and VoATM while enabling easy integration with devices where other requirements are needed.
Octasic's OCT6100 Series echo canceller performs carrier-class transparent echo cancellation and voice quality enhancements (VQE) with extremely low power and small board space requirements (16mm square footprint, the smallest in the industry).
Some features include: 32-672 channels of G.168-2002 echo cancellation; 128ms tail/channel (on all channel densities); adaptive noise reduction; extensive signalling tone detection/generation; and Octasic Music Protection, among a host of other features.
An application note detailing how voice gateways may be easily implemented using the TranSwitch and Octasic devices will be available in April 2005.
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