Nihon solder exhibits high ductility

A Nihon Superior product story

Edited by the Electronicstalk editorial team Mar 10, 2009

Nihon Superior has announced the SN100C high-ductility, lead-free solder that provides high impact strength.

A high-ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.

The fracture area of SN100C is similar to that of Sn-37Pb at the shear speed of 100mm/s but the fracture area for Sn-3.0Ag-0.5Cu is smaller than Sn-37Pb.

The fracture area of SN100C is slightly smaller than that of Sn-37Pb at the shear speed of 1,000mm/s, while the Sn-3.0Ag-0.5Cu fracture area is much less than Sn-37Pb due to its low ductility and brittleness.

Comparing the fracture areas, Sn-37Pb>SN100C>Sn-3.0Ag-0.5Cu.

In general, a solder alloy with a larger fracture area can absorb greater energy and shock due to its ductility and ability to deform.

Additionally, Sn-3.0Ag-0.5Cu is brittle and resistant to deformation, where SN100C is ductile like Sn-37Pb.

SN100C (Sn-0.7Cu-0.05Ni+Ge) has no shrinkage defects, reduced copper erosion, and its high ductility inhibits growth of the IMC layer.