Product category: Memory Devices and Modules
News Release from: NEC Electronics (Europe) | Subject: SMAFTI
Edited by the Electronicstalk Editorial Team on 07 August 2006
SiP technology solves size restrictions
Novel system-in-package technology is capable of stacking logic and gigabit-class memory in a single package to enable high-speed, high-definition image processing in mobile devices.
NEC Corporation and NEC Electronics Corporation have unveiled a new system-in-package (SiP) technology capable of stacking logic and gigabit-class memory in a single package to enable high-speed, high-definition image processing in mobile devices The new SiP technology, SMAFTI (smart connection with feed-through interposer), features a three-dimensional (3D) chip connection whose approximately 60um gap and 50um-pitch microbump between the logic and memory devices can support transmissions up to 100Gbit/s
This article was originally published on Electronicstalk on 16 May 2001 at 8.00am (UK)
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