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Product category: Analogue and Mixed Signal ICs
News Release from: National Semiconductor | Subject: Micro SMDxt packaging
Edited by the Electronicstalk Editorial Team on 11 January 2006
Micro chip package promises major space
savings
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The micro SMDxt (micro surface mount device extended technology) chip package, is the latest generation of wafer-level package technologies.
Continuing decades of packaging innovation, National Semiconductor has developed the micro SMDxt (micro surface mount device extended technology) chip package, the company's newest generation of wafer-level package technologies The new package, which builds on National's highly successful micro SMD, uses a unique structure that enables high-reliability products with bump counts of 42 to 100 bumps at a 0.5mm pitch without any underfill