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News Release from: Molex UK
Subject: Micro-Fit 3.0
Edited by the Electronicstalk Editorial Team on 5 September 2003

Headers combine high densities with reliability

The new Micro-Fit 3.0 compliant pin interface headers from Molex provide high reliability for high-density applications.

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The new Micro-Fit 3.0 compliant pin interface headers from Molex provide high reliability for high-density applications. The press-fit headers require no soldering and are ideal for applications that include servers, fan tray assemblies and backplanes. Extremely versatile, the new Molex headers are appropriate for either power or signal uses, as they can carry up to five amperes per circuit.

They are fully polarised to help ensure proper mating and feature fully isolated contacts for electrical and mechanical integrity.

Dual-row vertical headers are available with 2 to 24 circuits for the standard version and 4 to 24 circuits for the blind-mate version.

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