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Product category: Heatsinks and Thermal Management
News Release from: Molex UK | Subject: Copper-core radial-fin heatsinks
Edited by the Electronicstalk Editorial Team on 22 May 2001
Heatsinks generate 360-degree airflow
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Molex is helping to offer maximum thermal performance and quieter PCs with its latest product - copper core radial fin heatsinks.
Molex is helping to offer maximum thermal performance and quieter PCs with its latest product - copper-core radial-fin heatsinks for applications with SECC2 and PGA microprocessors found in personal computers, workstations and servers Using Molex's patent pending radial folded fin design, these heatsinks generate a 360-degree airflow that results in higher volumetric efficiency and lower fan noise than traditional extruded heat sinks