Product category: Communications ICs (Wired)
News Release from: Zarlink Semiconductor | Subject: ZL50111 family
Edited by the Electronicstalk Editorial Team on 06 October 2004
Processors package up to four circuits
Following the launch of three low-density CES-over-packet processors, Zarlink Semiconductor now offers the industry's only end-to-end portfolio of circuit-to-packet devices.
Following the launch of three low-density CES (circuit emulation services)-over-packet processors, Zarlink Semiconductor now offers the industry's only end-to-end portfolio of circuit-to-packet devices The three-chip ZL50120 family uses CES-over-packet technology to seamlessly "tunnel" one, two or four streams of TDM voice, video and data traffic, with associated timing and signalling, across Ethernet, IP and MPLS (multiprotocol label switching) networks
This article was originally published on Electronicstalk on 23 Sep 2003 at 8.00am (UK)
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