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Product category: PCB Assembly Equipment and Tools
News Release from: Metcal | Subject: Micro Fine rework tips
Edited by the Electronicstalk Editorial Team on 18 July 2002

Tiny rework tips tackle smaller packages

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Metcal has developed a new range of Micro Fine rework tips, designed to make it easier for operators to rework miniature components such as 0402s and 0201s on compact high-density boards.

Metcal has developed a new range of Micro Fine rework tips, designed to make it easier for operators to rework miniature components such as 0402s and 0201s on compact high-density boards The extensive range of Micro Fine rework tips includes: the STTC-X90, specifically designed for the soldering and touch-up of micro components down to 0201s; the SMTC-X171, a micro tip that works from a topside angle for improved microscope viewing when reworking or removing micro chip caps or components; the SMTC-X172, designed for fine drag and point-to-point soldering, allowing lead-to-lead or solder bridge clean up and permits access between components; the SMTC-X174, a long-reach micro hoof with a small surface area for drag soldering compo