Product category: Design and Development Software
News Release from: Mentor Graphics UK | Subject: Latest generation of PADS flow PCB design software
Edited by the Electronicstalk Editorial Team on 8 March 2007
Latest generation of PADS
flow PCB design software
The latest generation of PADS flow PCB design software has highly automated functions to implement RF and microwave circuitry and performs design for fabrication checking early in the design process
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Mentor Graphics has brought out PADS2007, the latest generation of PADS flow PCB design software. This newest release offers layout designers and engineers the ability to implement RF and microwave circuitry using highly automated functions, perform design for fabrication (DFF) checking early in the design process, and optimise performance with advanced high-speed analysis/verification functions, thus significantly improving their productivity and design quality.
'Mentor Graphics continues to invest in the future of PADS by strengthening the capabilities of designers to integrate RF circuitry design, high-speed net analysis and routing, and DFF into the PADS design flow', says Dan Boncella, Director of Marketing, System Design Division, Mentor Graphics.
'This new release extends Mentor Graphics' technology leadership by moving these sophisticated design capabilities into the PADS desktop PCB solutions'.
'Harris Corporation is excited about the new enhancements and features that are included in the new PADS 2007 release'.
'The new library structure and direct DXF into the decal editor will save hours of effort for our EDA librarian staff by solving alphanumeric translation issues and importing RF modeling directly into the decal editor', says John Adamski, EDA Specialist, Harris Corporation, RF Communications Division.
'The new RF module has several time-saving features'.
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'Trace manipulation for RF circuits, automated via shielding for sensitive traces, via plane flooding feature that is user selectable for interior plane fill or exterior (edge) fill'.
'Manual via shielding for RF or EMI is now a thing of the past'.
Additional enhancements in this release include: High-speed routing improvements: controls for matched length nets and differential routing improvements.
Square and chamfered corners, DXF-in import, and via matrixing enhancements for RF design.
Blind/buried via drill table improvements: designs with partial vias (blind or buried) are automatically updated with the layer pairs and drill count of the partial vias in the design.
Alphanumeric pin improvements simplify creation of large BGA-based parts.
ECO enhancements: includes comparison of design rules between the schematic and layout databases.
Design for fabrication (DFF) analysis: powerful fabrication checks, such as acid trap, starved thermals, solder mask slivers are checked in the CAD environment and database, allowing the designer to identify and correct manufacturing problems in PADS Layout, before Gerber generation.
Pin number visibility: the user has the ability to turn on/off the visibility of the component pin numbers, either numeric or alpha-numeric, improving designer productivity during routing.
SI analysis: integration of DxDesigner and the HyperLynx LineSim tool through a new interface allows fast transfer of a circuit for analysis and back annotation of termination resistor values.
analogue simulation: provides a board level simulation analysis and verification through a common schematic editor for both simulation and PCB design entry.
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