Product category: Design and Development Software
News Release from: Mentor Graphics UK | Subject: Expedition
Edited by the Electronicstalk Editorial Team on 5 February 2004
PCB layout kits are
ready for next Intel chipset
Mentor Graphics provided Intel with drop-in core layout kits for use with the Expedition PCB design flow for its next-generation chipset, codenamed Grantsdale
Mentor Graphics provided Intel with drop-in core layout (DCL) kits for use with the Expedition PCB design flow for its next-generation chipset, codenamed Grantsdale. The DCL kit, available through Intel, will provide an Intel reference motherboard design, integrating the CPU, chipset and other motherboard components for use with the Expedition PCB design flow, enabling personal computer motherboard OEMs and ODMs to shorten their design times.
This article was originally published on Electronicstalk on 5 February 2004 at 8.00am (UK)
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The DCL kit for Expedition will be available this year following the introduction of the new chipset by Intel.
As microprocessor speeds continue to increase, it is becoming more complex to meet interconnect timing and signal integrity constraints while placing and routing the critical components, while also minimising the number of layers and overall size of the PCB.
Intel is addressing this challenge by providing a reference motherboard design in Mentor's Expedition design solution to its customers.
"Our customers rely on Expedition to help them meet their performance and time-to-market goals.
Working with Intel on this project we believe will greatly help our customers to efficiently integrate component technology from Intel while also taking advantage of the productivity and performance gains enabled by Expedition", said Henry Potts, Vice President and General Manager, Systems Design Division, Mentor Graphics.
"The work Mentor Graphics has invested in these DCL efforts should allow its customers to take advantage of the product launch collateral Intel makes available to our developers, such as this DCL", said Mary Madison, Director of Platform Applications Engineering in Intel's Desktop Platforms Group.
The Expedition Series offers advanced functionality with ease-of-use for the creation of today's most complex PCB designs.
The Expedition Series features the industry's best place and route environment, powered by AutoActive technology.
The scalable product configuration of the Expedition Series allows designers to choose the right level of automation for their design needs.
Expedition's tightly integrated systems design environment features a common database and common user interfaces and rules to ensure data integrity is maintained from concept to manufacturing.
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