High density, hot-swap power solutions

News Release from: Magnetek
Subject: HP750 and HP850
Edited by the Electronicstalk Editorial Team on 1 December 2005

Compact supplies meet UL requirements

The latest additions to the Magnetek HP power supply family comply with Underwriters Laboratories' requirements to display the UL recognised mark.

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The latest additions to the Magnetek HP power supply family comply with Underwriters Laboratories' requirements to display the UL recognised mark. Also compliant with PoE and IEEE802.3AF standards, Magnetek's ultracompact HP750 and HP850 modular AC/DC power supplies provide isolated outputs of up to 750 and 850W, respectively. With inputs from 85 to 264V AC at frequencies from 47 to 63Hz, both units are designed for stand-alone operation as well as modular front-end configurations in distributed power systems in telecom networks, data storage systems, high-end servers, medical and other demanding applications.

Measuring a slim 1U in depth and packing power densities of 9.38 and 10.63W/in3, respectively, the modular HP750 and HP850 offer N+1 redundancy with hot-swap capability, interruptible 12C interface, and easy insertion/extraction connectors.

Both units are power-factor corrected with no minimum load requirement, deliver full power at temperatures up 50C, and incorporate single-wire current sharing, self-contained ORing diodes and current-limit as well as overvoltage protection.

To facilitate power system integration, Magnetek's HP850 racks offer high-power hot-plug capability for critical applications.

Also displaying the UL recognised mark, the racks accommodate three internally paralleled, load-sharing HP850s for automatic load distribution.

Each rack delivers up to 1700W total power at low line (2 +1) or 2500W total power at high line, and includes an I2C communications interface.

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