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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Master Bond | Subject: EP121AO
Edited by the Electronicstalk Editorial Team on 16 December 2004
Epoxy compound handles hot duties
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A new low-viscosity thermally conductive, electrically insolative two-component epoxy compound is ideal for potting, casting, encapsulation and sealing for service temperatures up to 260C.
Master Bond, has formulated EP121AO, a new low-viscosity thermally conductive, electrically insolative two-component epoxy compound for potting, casting, encapsulation and sealing for service temperatures up to 260C The Master Bond EP121AO epoxy resin compound is comprised of a specially developed heat resistant liquid epoxy resin and a unique curing agent which exhibits unexcelled thermal stability