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Product category: CompactPCI Boards and Assemblies
News Release from: Kaparel Corp
Edited by the Electronicstalk Editorial Team on 23 January 2003

Teradyne and Kaparel in circuit accord

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Teradyne Connection Systems Division (TCS) and Kaparel Corp have formed a supply partnership for high-performance circuits (HPCs)

"Standard backplanes, such as CompactPCI, VME, and the introduction of switch fabrics, are becoming increasingly complex as chip technology and density increases", said Tom Sutherland, General Manager, Kaparel Corp. "Teradyne's leadership in high-volume fabrication of complex high performance printed circuits will help us to meet the growing technology requirements of our customers".

Under terms of the agreement, Teradyne will provide Kaparel with open standard printed circuit boards for their backplane designs.

The two companies will also participate in a technology exchange that will improve printed circuit board design for use with open standards, such as PICMG 3.0.

"We are excited about the partnership, as this continues to leverage each company's core competencies and technology", said Leigh Eichel, Marketing Manager for Teradyne's Printed Circuit Business Unit.

"Kaparel's expertise in high speed printed circuit board layout is a perfect fit with our own engineering and manufacturing capabilities.

Moreover, as a Tier A HPC supplier, Teradyne will ensure a continuity of supply combined with a relentless focus on quality for Kaparel's most demanding customers".

Teradyne's high performance printed circuit board capabilities include prototype through production volume manufacturing of panel sizes up to 24 x 54in, 0.05 to 0.5in thick, deep micro via technology, and layer counts from 6 to 60.

Kaparel specialises in high slot count, hot swap and high availability systems and has a complete line of standard off-the-shelf products and specialises in custom solutions.

"The global design community will greatly benefit from the combination of Teradyne's and Kaparel's world class engineering expertise", said Robert Cutler, High-Speed Signal Integrity Expert for RDC Consulting.

"As data rates across backplanes push to 10Gbit/s+, the kind of higher level engineering both companies bring to the table becomes critical to success".

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