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Product category: PCB Assembly Equipment and Tools
News Release from: Kaisertech | Subject: MicroJoin model 2100 pulsed heat hot bar bonder
Edited by the Electronicstalk Editorial Team on 05 September 2001

Hot bar bonder tackles many tasks

Kaisertech has introduced the low-cost MicroJoin model 2100 pulsed heat hot bar bonder that integrates the critical features and functions needed for soldering, heat seal or ACF bonding

Kaisertech has introduced the low-cost MicroJoin model 2100 pulsed heat hot bar bonder that integrates the critical features and functions needed for soldering, heat seal or ACF (anisotropic conductive film) bonding Users can also cost-effectively tailor the unit to almost any specific bonding application such as ribbon cables, flex connectors, TAB-to-board and heat seal connectors