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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Intertronics | Subject: Thermoset MD-140
Edited by the Electronicstalk Editorial Team on 09 October 2001
Single-component adhesive keeps dice in
place
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Intertronics has announced the introduction of Thermoset MD-140, a silver-filled die-attach adhesive with excellent electrical and thermal performance.
Intertronics has announced the introduction of Thermoset MD-140, a silver-filled die-attach adhesive with excellent electrical and thermal performance The epoxy-based, single-component adhesive is ideally suited for use in thermally demanding, die-attach applications such as microprocessor, power semiconductor and VLSI assembly, in fact anywhere electrical conductivity combined with superior thermal performance is required for bonding to laminate, ceramic and metal substrates