Product category: Electronics Manufacturing Machinery and Materials
News Release from: Inseto (UK) | Subject: TPT wire bonders
Edited by the Electronicstalk Editorial Team on 22 March 2006
Manual wire bonders are low-cost intro
Low-cost manual fine wire bonders are ideal for startup companies, universities and laboratories
Inseto has introduced a new range of low-cost manual fine wire bonders in the UK and Ireland from TPT of Germany. The new range compliments TPT's existing series of fine wire bonders by providing a more manual low cost solution, which is ideal for startup companies, universities and laboratories.
This article was originally published on Electronicstalk on 22 March 2006 at 8.00am (UK)
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Three machines are incorporated in the range, including the HB02 wedge bonder, HB04 gold ball bonder and HB05 flexible wedge and ball bonder.
The HB05 model, which can be interchanged between bonding modes in less than 5 minutes simply by changing the bonding tool and selecting the appropriate bonding option, allows the user to have one machine where normally they would require two.
All machines incorporate a wire feed angle of 90 degrees, providing the systems with deep-access bonding capabilities for 17 to 50um wire diameters, or ribbon bonding of up to 25 x 250um, and a simple front mounted control panel for adjusting machine configuration and parameter settings.
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