News Release from: Integrated Microelectronics
Edited by the Electronicstalk Editorial Team on 11 January 2005
Internepcon provides Japanese showcase
Integrated Microelectronics will exhibit in the Internepcon World Japan 2005 from 19th to 21st January 2005 at Tokyo Big Sight in Ariake, Tokyo, Japan.
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Integrated Microelectronics (IMI) will exhibit in the Internepcon World Japan 2005 from 19th to 21st January 2005 at Tokyo Big Sight in Ariake, Tokyo, Japan. The company will showcase its products and services on Booth 43-41 in East Hall 5 - EMS Zone at the 6th Printed Wiring Board Expo. IMI President and Chief Executive Officer Arthur R Tan says: 'We are exhibiting in Internepcon for the third time'.
'We always participate in this show because it is a good venue to showcase our complete and high value electronics manufacturing solutions'.
IMI offers manufacturing capabilities - such as printed wiring board (PWB) assembly, subassembly and complete electronics product assembly services - and higher value solutions in the areas of design and product development, engineering, prototyping, and shipment and order fulfillment.
Tan says: 'We serve some of the largest global original equipment manufacturers including Japanese OEMs who are leaders in the storage device market'.
'Japan has always been the primary market of IMI'.
'Our Japanese customers account for 70% of our total annual revenues and we work hard to increase revenues from this market'.
Tan adds: 'We provide value to Japanese and other global OEMs who decide to outsource to us by allowing them to concentrate on their core competencies such research and development and product marketing while we handle product development, manufacturing, and shipment for them'.
'They can use our available resources and capacity, and leverage our quality systems, while being sure that there will no infringement of their intellectual property rights'.
Eazix, IMI's design service and original design manufacturing (ODM) subsidiary, will exhibit its wireless connectivity products including platforms for W-iFi for high-speed link to the Internet for local area networking and for Bluetooth for personal area networking.
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