Product category: Memory Devices and Modules
News Release from: Intel Corporation | Subject: Wireless Flash
Edited by the Electronicstalk Editorial Team on 24 February 2004
Flash memory shrinks to 90nm process
Intel has developed the world's first NOR Flash memory device on 90nm manufacturing technology
Intel Wireless Flash memory is the company's fifth generation of Flash memory technology and will retain the high performance features of Flash memory needed by wireless handset makers. In a keynote address at last week's Intel Developer Forum, Intel Executive Vice President Sean Maloney explained that Intel Wireless Flash memory manufactured on 90nm process technology has an approximately 50% smaller die size compared with the previous generation, which will lower costs and double Intel manufacturing capability to meet the needs of customers.
This article was originally published on Electronicstalk on 24 February 2004 at 8.00am (UK)
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Flash chips reach 1Gbit using 65nm process
Intel Corporation is the first to sample NOR multilevel cell Flash memory chips at 1Gbit density using its advanced 65nm process technology
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Intel has committed to extended lifecycle support for the Intel Core Duo processor used by developers of embedded solutions
The first Flash memory product will be a single-bit-per-cell device, with devices available later this year on Intel's multilevel cell (MLC) technology, which holds twice the amount of information in one cell.
"Intel Wireless Flash memory is the highest performance solution available today for wireless applications", said Tom Lacey, Vice President, Intel Flash Products Group.
"It combines four innovations into one product: low 1.8V operation, direct code execution (execute-in-place), enhanced factory programming and dual code and data storage in one chip.
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Alliance aims to drive 3G adoption on laptops
The GSM Association and Intel Corporation have outlined an initiative to facilitate and drive the adoption of the GSM family of technologies in laptop computers
STMicroelectronics and Intel agree on Flash format
A common Flash memory subsystem will lower development costs for handset OEMs and enable them to get to market faster with feature-rich phones
All four are important features which enable our wireless customers to develop reliable state-of-the-art devices".
Intel Wireless Flash memory on 90nm process technology is the latest member of the Intel stacked chip scale packaging (stacked-CSP) product line.
By offering a common package pinout and Intel Flash software solutions across a range of densities, stacked Flash memory integration and upgrades are easily made and enable device designers to pack more memory into less space.
Intel combines its high-density Flash memory products with flexible RAM options to offer densities up to 1Gbit in a small package size of 8 x 11mm.
With more than 18 years of Flash memory industry experience, Intel continues to be a leader in NOR Flash memory.
Intel is a leading supplier of Flash memory to the wireless market segment and also provides solutions for other applications including consumer electronics and communications devices.
Intel Wireless Flash memory based on 90nm process technology will sample in April in densities of 64Mbit.
Volume production is planned for the third quarter of this year, with a suggested price of $10.26 in 10,000-unit quantities.
Intel plans to sample MLC Intel StrataFlash Wireless memory on 90nm later this year.
These MLC devices will include 256 and 512Mbit discrete densities and will offer various stacked configurations.
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