Product category: Electronics Manufacturing Machinery and Materials
News Release from: Indium Corporation of America | Subject: BP-3106
Edited by the Electronicstalk Editorial Team on 20 May 2005
Bumping paste produces
large solder deposits
Novel BGA bumping solder paste produces large deposits of solder material in bumping and other applications using only an SMT printer with a bumping stencil
Indium Corporation's new BP-3106 BGA bumping solder paste produces large deposits of solder material in bumping and other applications using only an SMT printer with a bumping stencil. BP-3106 bumping solder paste is applied using existing equipment, allowing the flexibility of increasing the throughput by increasing the BGA substrate panel size and printing speed without extra investment in expensive equipment, such as BGA ball placement hoppers.
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BP-3106 bumping solder paste has excellent release properties, robust slump resistance, and ultralow voiding.
It can be used for both area array and peripheral BGAs and passes SIR before and after cleaning.
Standard packaging includes 500g jars and 700g Semco cartridges.
In addition, this paste can be applied using an enclosed printhead such as DEK's ProFlow and MPM rheo pump.
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