Product category: Heatsinks and Thermal Management
News Release from: Hybricon Corp
Edited by the Electronicstalk Editorial Team on 24 February 2006
Alliance aims to cool embedded systems
Hybricon and Parker Hannifin Advanced Cooling Systems are working together to provide advanced cooling technology in the embedded computing market
Hybricon Corporation, a provider of integrated system solutions, electronic enclosures, and backplanes, and Parker Hannifin Corporation Advanced Cooling Systems have signed a comarketing agreement to leverage each organisation's core capabilities in order to provide more value to customers. Hybricon's expertise in designing enclosure systems combined with Parker Hannifin's expertise in liquid and spray evaporative cooling technologies will provide customers with superior liquid cooling system solutions.
This article was originally published on Electronicstalk on 24 February 2006 at 8.00am (UK)
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According to Robert Sullivan, Hybricon's Vice President of Technology: 'This agreement allows Hybricon to leverage Parker Hannifin's advanced cooling technology, along with Hybricon's advanced electronic packaging technology, in order to provide leading edge solutions to our customers'.
'Working together, we can provide superior solutions in new applications that require leading edge cooling technologies'.
According to Cathy Suever, Parker Hannifin's Business Unit Manager for Advanced Cooling Systems 'This agreement will help Parker Hannifin to accelerate deployment of its advanced cooling technology in the embedded computing market, leveraging Hybricon's packaging experience and technology to provide solutions in applications requiring advanced liquid and/or spray evaporative cooling technology'.
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