News Release from: Hybricon Corp
Subject: RME1021M Series
Edited by the Electronicstalk Editorial Team on 24 March 2005
Rugged enclosures keep dense boards cooler
A new line of 10U rack-mount high power enclosures features high quality ruggedised construction and a compact stackable design for vertically mounted cards.
Note: Readers of the free Electronicstalk email newsletter will have read this news when it was announced. Find out how to register for your free copy now.
Hybricon Corp has released a new line of 10U rack-mount high power enclosures (the RME1021M Series) which feature high quality ruggedised construction and a compact stackable design for vertically mounted cards. The RME1021 enclosures are designed to cool extremely dense CPU and DSP boards. Dual DC impellers powered by a dedicated power supply output provide 456 litre/min per slot - sufficient cooling for 125W per slot.
The RME1021M enclosures are designed to meet MIL-STD-461 EMI radiated and conducted emissions and susceptibility standards as well as MIL-STD-810, MIL-S-901, and MIL-STD-167 environmental requirements (a commercial version, the RME821C series, is also available).
Included are front and rear cover panels with honeycomb inlet and exhaust and provisions for shielded connectors for I/O.
The enclosures are available with 21-slot CompactPCI, VME64x, VME, or VXS backplanes and up to 2400W of embedded power.
A closed loop fan speed control has programmable settings for minimum and maximum speeds and temperature break points.
• Hybricon Corp: contact details and other news
• Email this news to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Site copyright © 2000-2007 Pro-Talk Ltd, UK. Based on information from Hybricon Corp
Click on the advertisement to visit the advertiser's web site now