Low-pressure moulding process to star at APEX: News from Henkel Loctite Adhesives

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The Electronics Division of Henkel will again use APEX as the stage to promote one of its most innovative process solutions: Macromelt low-pressure moulding. The fast and flexible packaging solution delivers a low pressure alternative to conventional injection moulding and potting techniques, enabling the encapsulation of diverse components with highly miniaturised features. The unique polyamide hotmelt Macromelt material allows for the encapsulation of the circuitry and the formation of the outer shell of the component all in one step.

Its simplicity is its advantage: the process only requires a melt unit, low pressure dispensing system, and a mould, which reduces the number of steps required by traditional potting processes and saves time and cost.

The Macromelt solution presents a significant advantage to manufacturers through improved resource utilisation and delivers measurable process improvements over traditional methods.

Demonstrations of this inventive process will take place throughout the 3-day event.

Henkel technical experts will also be on-hand at the show to discuss how the company's full suite of lead-free products, including Multicore LF318, Pb-free capable fluxes, and Loctite brand lead-free compatible underfills and adhesives combine to deliver a complete lead-free manufacturing solution.

For those manufacturers who have yet to make the complete transition to lead-free production but still require a thermally compatible material, a full technical presentation on Multicore MP218 will be available.

Also being launched at this year's APEX event is Henkel's Loctite Bead-on-Bead thermally conductive adhesive products.

The new materials, Loctite 3875 and Loctite 3876, are based on proven proprietary structural adhesive technology and deliver a novel approach to bonding heat-dissipating electrical and electronic devices to conventional heatsinks and spreaders.

Loctite Bead-on-Bead is a novel two-part, no-mix, no-measure acrylic adhesive chemistry that allows manufacturers to apply each part independently to the component so that mixing occurs only when the two items to be bonded are joined together.

This replaces the traditional method of pre-mixing or solvent activated systems and eliminates issues associated with pot life management and represents dramatic increases in resource utilisation for manufacturers.

The new technology offers a 40% improvement in cooling performance over previous products and allows manufacturers to use smaller and more cost-effective heatsinks.

Henkel will be on Booth 1321 at APEX, from 8th to 10th February 2006 at the Anaheim Convention Centre. Request free introductory details about products from Henkel Loctite Adhesives....

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