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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Hysol GR9810
Edited by the Electronicstalk Editorial Team on 27 July 2004
Moulding compound speeds SIP integration
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Hysol GR9810 is a technologically advanced epoxy moulding compound designed for system in package (SIP) on laminate applications.
Hysol GR9810 is a technologically advanced epoxy moulding compound designed for system in package (SIP) on laminate applications Hysol GR9810 epoxy moulding compound is designed for use as an overmould on a wide variety of laminate-based moulded array packages including SIP and flip-chip array packages that have been conventionally underfilled