Surface-mounting clips speed screening onboard

A new range of surface mount EMI/RFI shield clips saves PCB space and reduces assembly and rework time by eliminating through hole manufacturing processes.

Harwin has introduced a new range of surface mount EMI/RFI shield clips which save PCB space and reduce assembly and rework time by eliminating through hole manufacturing processes.

Explains Richard McDonnell Product Manager for the Midi and Mini clips: "Traditional shielding cans are soldered to the board using through-hole technology".

"This is often performed after the main automated assembly process using manual secondary soldering operations".

"Not only is this process time consuming and costly but causes further difficulties should reworking become necessary".

Supplied in industry standard tape and reel packaging, Harwin's RFI shield clips are placed on the board and soldered using standard SMT placement equipment.

The shielding can is then fitted during final assembly within seconds.

As it is possible to remove and refit the can a number of times, tuning and rework operations are simplified.

Therefore both initial production and rework costs are significantly reduced.

The Midi RFI clip is designed for shielding cans using 0.3mm thick material: the Mini version is 40% smaller and is suitable for shield cans 0.13-0.23mm thick.

Clips are available in 100% tin plate.

The Midi clip is also available in a beryllium-free copper option, suiting it to applications covered by the WEEE (Waste Electrical and Electronic Equipment) and the End of Vehicle Life Directives.

Harwin's EMI/RFI clips are targeted at telecomms basestations, radiocomms, data processing and in-car entertainment systems.

Previous devices have been successfully used in diverse applications such as the Bowman military radio project and automotive satnav/DVD players.

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