SMT test point aids functional testing

A novel surface mount test point can be used to replace manually placed loops previously used for attaching test probes.

As more and more electronic assemblies are produced using surface mount technologies, the need to functionally test finished goods remains an area that can be improved.

As a step towards making functional testing more straightforward, Harwin has developed a new surface mount test point that can be used to replace manually placed loops previously used for attaching test probes.

The surface mount test point is supplied in standard tape and reel packaging and can be placed by any mainstream surface mount placement machine, removing the need for additional labour to hand place more traditional test loops.

The test point is manufactured from brass with a tin plated finish for excellent solderability and ease of assembly.

It has also been design to be small and unobtrusive, taking up a minimal amount of printed circuit board real estate.

Functional testing can be performed as previously undertaken, with test probes easily attached to the SMT test point in the normal way.

The test point is mechanically strong and is attached to the printed circuit board using a single solder pad giving durability and long life should the end product require maintenance testing or additional work later in its life cycle.

All Harwin CAS SMT products are supplied in industry standard tape and reel packaging to allow easy placement and cost effective delivery.

No special feeders or nozzles are required to place this part.

Efficient in-house manufacturing processes also ensure that the products are priced very competitively.

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