News Release from: Fujitsu Microelectronics Europe
Subject: 1MBit FRAM
Edited by the Electronicstalk Editorial Team on 11 November 2004
Nonvolatile memory mass production commences
Fujitsu Microelectronics Europe has launched its 1MBit FRAM, the highest ever capacity for FRAM nonvolatile memory, also featuring high speed read and write operations and low power consumption.
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Fujitsu Microelectronics Europe launches its 1Mbit FRAM, the highest ever capacity for FRAM nonvolatile memory, also featuring high speed read and write operations, low power consumption, and high endurance. There is a growing demand for nonvolatile memory with high-speed operation, low power consumption, and high endurance in office application equipment (eg printers, copier machines), portable information devices and home appliances (eg microwaves, washing machines), for store security information and condition monitoring. Ferroelectric memory (FRAM) fulfils these requirements.
Fujitsu first marketed embedded LSI FRAM in 1999 and, in addition, also produced 256Kbit application specific stand-alone memory for the nonvolatile memory market.
The company has to date already sold more than 150 million FRAM products.
With the latest 0.35um 1T1C cell technology, Fujitsu was able to develop two 1Mbit FRAM devices - gMB85R1001 (x8bit) and gMB85R1002 (x16bit), the highest capacity of any of its FRAM products.
The company offers next generation memory solutions with its expanding FRAM product line-up, where the load on production, maintenance and the environment is drastically lightened and development costs are also reduced by using RAM/ROM replaceable FRAM.
Fujitsu has been a world leader in FRAM development and mass production, and will be the first company to mass produce mega bit class FRAM.
With the combined features of both RAM and ROM, compared to EEPROM the speed of writing is more than 10,000 times faster, power consumption in write operation is tens of times smaller, and also rewriting endurance is more than 100,000 times higher.
Fujitsu has also introduced 1T1C cell technology that can realise twice as much capacity than its traditional 2T2C cell technology.
This high capacity has been achieved without increasing the die size.
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