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Product category: Memory Devices and Modules
News Release from: Fujitsu Microelectronics Europe | Subject: MB84VY6A4A1
Edited by the Electronicstalk Editorial Team on 28 October 2002
Mobile memory device crams in six of the
best
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Fujitsu has used its latest PS-MCP (package stacked multichip package) technology to produce a high-density and large-scale MCP combining six memory devices for mobile communications.
Fujitsu has used its latest PS-MCP (package stacked multichip package) technology to produce a high-density and large-scale MCP combining six memory devices for mobile communications The MB84VY6A4A1 is the first device of its kind, and mass-production will commence early November 2002