Software optimises thermal design: News from Fluent

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Fluent has released version 4.2 of its Icepak electronics cooling design software. The newest version of Icepak incorporates optimisation capabilities for thermal design of electronic systems. Design optimisation obviates the need for trial-and-error simulations in determining the optimum parameters of a thermal design.

The ease-of-use of Icepak's embedded optimisation module coupled with its efficient gradient-based optimisation algorithm enables the thermal design process to be completed in hours rather than days.

Enhanced parametric capabilities including logic-based control enable complete exploration of the design space with a single Icepak model.

Parametric capabilities include the option to turn on or turn off objects based on pre-selected criteria.

Powerful post-processing capabilities like comprehensive user-defined post processing functions and reporting on multiple data sets allow for greatly speeding up the design process.

In addition, Icepak 4.2 offers a mixed meshing capability where the user can use mixed tetrahedral and hexahedral meshes, a power table for easy entry of component powers, transient Joule heating capabilities, macros for a variety of uses including creation of Delphi compact models of IC packages, accurate modelling of thermoelectric coolers (TECs) and many more features.

Icepak 4.2 also allows you to create post-processing and reporting variables that can be used either during an exploration of the parametric design space or for tracking while performing design optimisation.

Icepak 4.2 is available on Unix, Windows and Linux platforms.

It is provided at no additional cost to all current Icepak users who have chosen to purchase upgrades along with their Icepak licences.

Icepak licence fees depend on the number of seats purchased.

Annual licence fees include unlimited technical support.

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