Product category: Communications ICs (Wired)
News Release from: Frontier Silicon | Subject: DAB receiver modules
Edited by the Electronicstalk Editorial Team on 24 February 2004
DAB receiver module
aims for handset applications
Samsung Electro-Mechanics and Frontier Silicon have co-operated to develop a miniature low power DAB receiver module specifically targeted for integration into mobile phone handsets
Samsung Electro-Mechanics and Frontier Silicon have co-operated to develop a miniature low power DAB receiver module specifically targeted for integration into mobile phone handsets and other communications devices such as PDAs and smartphones. The module from Samsung Electro-Mechanics measures just 30 x 38mm and is only 2.5mm high, to meet one of the most important requirements in space constrained mobile phone handsets.
This article was originally published on Electronicstalk on 24 February 2004 at 8.00am (UK)
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"We are seeing increasing interest from mobile phone manufacturers in the integration of DAB, both for audio and data applications", said CK Nam, manager, of the broadcast systems team at Samsung Electro-Mechanics.
"By co-operating with Frontier Silicon we have been able to provide our customers with a small and low powered module that can be used to realise this requirement".
"We are delighted to have been able to work with Samsung Electro-Mechanics on this market leading development", said Steve Evans, VP sales of Frontier Silicon.
"Their ability to engineer a DAB solution in such a tiny form factor with the requisite lower power consumption opens up the possibility of adding DAB to an exciting array of volume-manufactured products".
Based on the Chorus DAB processor, which is already at the heart of more than 600,000 DAB radios, the new module specially developed for mobile phone handsets has the capability to decode DAB across all of the audio and data bandwidths required by the DAB standard.
It includes the RF front end, the baseband circuits and its own embedded memory.
It operates as a slave module, which is controlled by the mobile phone's system processor over a serial interface.
The new module is sampling now and will be available in mass production during Q3 2004.
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