Simulation validates high-power chassis design
A Mentor Graphics Mechanical Analysis Division product story
Edited by the Electronicstalk editorial team Dec 20, 2007
Project demonstrates how thermal simulation can be used in the early stages of the design process to minimise expensive late-stage changes and reduce time to market.
Amphenol Total Connection Solutions (TCS) has used Flomerics' Flotherm software to overcome the thermal management challenges of a 14U chassis dissipating 1700W.