Presentation emphasises need for standards
A Mentor Graphics Mechanical Analysis Division product story
Edited by the Electronicstalk editorial team Mar 21, 2005
A presentation at the MicroElectronics Packaging and Test Engineering Council showcased emerging boundary-condition-independent thermal modelling standards in the electronics industry.
In a presentation at the MicroElectronics Packaging and Test Engineering Council, Sarang Shidore of Flomerics showcased emerging boundary-condition-independent thermal modelling standards in the electronics industry.
The new prop