Simulation helps boost chassis heat dissipation
A Mentor Graphics Mechanical Analysis Division product story
Edited by the Electronicstalk editorial team Jul 8, 2004
Thermal simulation played a key role in helping Hybricon design an 8U chassis that dissipates 30% more power than competing offerings.
Thermal simulation played a key role in helping Hybricon design an 8U chassis that dissipates 30% more power than competing offerings.
With 6U high vertical cards, 8U chass