Thermal and EM packages work together
A Mentor Graphics Mechanical Analysis Division product story
Edited by the Electronicstalk editorial team Apr 30, 2003
Design engineers can now conduct thermal and electromagnetic analyses simultaneously using the latest Flotherm and Flo/EMC v4.1 software.
Design engineers can now conduct thermal and electromagnetic analyses simultaneously - two design issues that impact on one another - using the latest Flotherm and Flo/EMC v4.1 software.
In addition to this ground-breaking capability, which will significantly reduce time-to-market for electronics companies, Flotherm v4.1 incorporates a number of other important enhancements including automatic sequential optimisation, multi-level nested grids (this alone can reduce software calculation times tenfold), and the ability to conduct thermo-mechanical stress calculations in order to predict reliability directly.
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