News Release from: FCI
Edited by the Electronicstalk Editorial Team on 14 November 2005
ATCA topology design reaches 10Gbit/s
FCI's AirMax VS high-speed connector technology has been designed into Northrop Grumman Interconnect Technologies' 16 slot dual star topology, built to reach speeds of 10Gbit/s.
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FCI's AirMax VS high-speed connector technology has been designed into Northrop Grumman Interconnect Technologies' 16 slot dual star topology, built to reach speeds of 10Gbit/s. Interconnect Technologies designed the PCB with mechanical mounting and Zone 1 power connections to leverage PICMG 3.0 ATCA components in NRZ signalling. The company, which designs and manufactures PCBs and backplane assemblies featuring multi-gigabit passive transmission channels, chose AirMax VS 4-pair vertical headers and right-angle receptacles because the connectors are scalable to very high-speed performance requirements; allow for custom pin count and pin assignment to greatly increase the flexibility of any design; offer multiple column spacings for optimum board layout resulting in low applied cost; and utilise a shieldless design that provides improved electrical performance, reduced mating forces and reduced cost.
The companies collaborated to enable validated 3-D models of the AirMax VS connector system to be incorporated into Northrop Grumman's databank of multi-gigabit passive channel components which facilitates fast design implementations of next generation backplane assembly systems.
'Incorporating AirMax VS models into the Databank enables us to rapidly implement the AirMax VS connector system into next generation platforms', said Mike Oltmanns, Marketing Manager of Northrop Grumman Interconnect Technologies.
'This initiative proves how combining connector technology with leading edge PCB fabrication capabilities and design tools can rapidly deliver next generation interconnect solutions'.
The AirMax VS system uses edge-coupling technology and an air dielectric between adjacent conductors, delivering high signal density with the industry's lowest insertion loss and lowest crosstalk, all without the use of costly and space-consuming metal shields.
It has been demonstrated to work in systems running as fast as 25Gbit/s.
Interconnect Technologies is a member of the Unified 10Gbit/s Physical Layer Initiative, which works to simplify and accelerate the implementation of next generation 10Gbit/s systems by promoting a common physical layer across multiple standards and markets to reduce the costs and risks associated with developing next generation systems.
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